11 May 2026
Formnext Asia Shenzhen 2026 turns up the heat on additive manufacturing to keep AI cool
Returning to the Shenzhen World Exhibition & Convention Center from 26 – 28 August, Formnext Asia Shenzhen 2026 will examine how additive manufacturing (AM) is being applied to one of AI infrastructure’s fastest-growing engineering demands: thermal management. With high-density AI server chips exceeding the thermal limits of traditional air cooling, manufacturers are turning to additive manufacturing to produce liquid cooling components that are too complex for standard machining. The exhibition will feature the equipment and materials behind these applications, set within a wider line-up spanning AM systems, materials, software, post-processing and production services. Confirmed participants include Bambu Lab, CNPC Powder, Creality, Farsoon Technologies, Graphenova, HBD, Intamsys, Kings 3D, Meshy AI, Raise3D, Southern Additive, Tripo AI, UNILASER, UnionTech and Zhongyuan Advanced Materials.