Formnext Asia Shenzhen's acclaimed fringe programme brings together leading experts from the manufacturing and forming industries to share insights and showcase technologies that will drive the industry forward. With an emphasis on the latest technologies and applications in additive manufacturing, the programme offers a valuable platform for attendees to stay ahead of the latest industry trends.
Global 3D Printing & AM Industry Summit – Major Events Coming H2 2026
- 2026 Shenzhen International Laser and Additive Manufacturing Forum
- China 3D Print Farm and Consumer-Grade AM Ecosystem Conference
- Overseas Market Opportunities for Chinese 3D Printing Companies Seminar
- Thermal Management and Liquid Cooling AM Forum
- Global AM Channel Partner & Dealer Business Matching Meeting
- Commercial Aviation and Aerospace AM Forum
- Metal Additive Manufacturing & The Binder Jetting Additive Manufacturing Technology Forum for the 3C Electronics & Smartphone Industry
- Advanced 3D Printing Technology & Application Forum for the Footwear Industry
- Robotics and Embodied Intelligence AM Forum
- Formnext Asia Shenzhen Maker Open Mic
- 3D Printing Technologies in Mould Making Summit
- Formnext Asia Shenzhen New Product Launch
3D Print Farm Conference and Farm Workshop Showcase
In 2026, the third Farm Conference strategically expands beyond 3D printing farm operations to embrace the entire consumer-grade 3D printing ecosystem, rebranding as the China 3D Printing Farm & Consumer Ecosystem Conference. Co-hosted by Formnext Asia Shenzhen and Nanjixiong, with exclusive sponsorship by Meshy AI, this annual event showcases the full value chain—from front‑end AI design and modeling software, desktop printers, materials, and post‑processing, to content creators, digital model platforms, small‑batch production, customization, and cross‑border e‑commerce. The concurrent Thought Leadership Summit gathers leading farm operators, industry experts, and application specialists to explore technology trends, business models, and future directions. Join us in 2026 to map the blueprint of the consumer 3D printing ecosystem.
Commercial Aviation and Aerospace AM Forum
Additive manufacturing is accelerating the low-altitude economy and commercial space sectors, moving from prototyping to serial production of critical components. This forum covers UAV, space, and aviation applications across FDM rapid iteration, SLS lightweight batch production, SLM integrated metal parts (30–40% weight reduction), and continuous carbon-fiber composite printing for large airframes. Technical topics include topology optimization, lattice design, fiber-reinforced nylon, titanium/aluminum alloys, MJF/SAF processes, monolithic airframe integration, and aerospace material certification. The forum unites engineers and industry leaders to address scaling challenges, driving innovation in structural efficiency, performance, and cost-effective manufacturing for next-generation flight systems.
Thermal Management and Liquid Cooling AM Forum
The inaugural Advanced Additive Manufacturing AI Thermal Management Summit, held at Formnext Asia Shenzhen 2026, addresses the critical thermal bottleneck in kilowatt‑level AI chips, 5G base stations, and EVs. Additive manufacturing—from pure copper printing to LPBF and binder jetting—disrupts conventional production of liquid cooling channels, ultra‑thin vapor chambers, and microchannel heat sinks. Global experts in AM, thermal design, and EV systems discuss monolithic forming, high‑conductivity materials (copper, aluminum, composites), and scaling from prototyping to mass production, aiming to deliver breakthrough solutions for next‑gen thermal challenges.
Robotics and Embodied Intelligence AM Forum
As the humanoid robotics industry enters its "year of mass production," R&D teams face critical challenges in monolithic forming of complex biomimetic structures, high-strength lightweighting, small-batch iteration, and cost-effective manufacturing. Additive manufacturing, with its design freedom and agile production capability, is emerging as a pivotal enabler from prototyping to serial production. This forum focuses on key technical areas including metal printing of robot frames and joints, biomimetic skin and flexible elastomers, lattice lightweight design, rigid‑flexible monolithic integration for dexterous hands, SLS nylon batch production, desktop rapid prototyping, and high‑performance aluminum/titanium alloy powders. Through real‑world case studies and engineering insights, we explore how AM addresses the practical challenges of scaling humanoid robot production.
Metal Additive Manufacturing Forum for the 3C Electronics & Smartphone Industry and The Binder Jetting Additive Manufacturing Technology Forum
This forum focuses on metal additive manufacturing and Binder‑Jetting technologies for consumer electronics, particularly smartphones and 3C devices. As lightweight design, precision structures, and customization drive the sector, these two technologies—one enabling monolithic complex metal parts, the other offering high‑efficiency, low‑cost production for large‑format, multi‑material batches—form a transformative matrix. Discussions cover serial production of phone mid‑frames, foldable hinges, and heat sinks via metal AM; forming quality and efficiency breakthroughs in BJ for titanium, stainless steel, and copper alloys; cost comparison and synergistic application; and critical challenges like post‑processing, sintering shrinkage control, and support design. The forum brings together equipment vendors, material developers, OEMs, and research institutes to chart the path from prototyping to mass production and define next‑generation standards for 3C electronics manufacturing.
Robotics and Embodied Intelligence AM Forum
This session focuses on the global expansion of China’s additive manufacturing industry. With years of technological accumulation, Chinese AM companies are now at a pivotal stage of “going global.” We examine key challenges—overseas certifications (CE, FDA, NRTL), patent barriers, channel development, and localized service—and explore strategies for entering diverse markets including Europe, the US, Southeast Asia, and the Middle East. Discussions cover market selection, intellectual property strategy, cross‑border e‑commerce, local partnerships, and full‑chain case studies. The goal is to move beyond product exports toward building brands, setting standards, and cultivating ecosystems in the global AM landscape.
Advanced 3D Printing Technology & Application Forum for the Footwear Industry
The 3D-printed footwear industry is entering a critical growth window, driven by the "zero-mold, zero-inventory" model that effectively addresses the pain points of traditional retail inventory. The global market is expected to reach at least RMB 50 billion in the next five years. This forum focuses on technological breakthroughs and commercialization pathways in additive manufacturing for the footwear industry. We invite you to submit speaking topics and share real-world case studies and industry insights across the following areas: innovations in elastomeric materials (PEBA, TPU, dual-cure polyurethane, foamed elastomeric resins, etc.), high-speed printing equipment and mass-production solutions, metal powders and mold printing for shoe molds, and the transition from customization to scaled delivery via "lights-out factories."